发明名称 |
SLURRY, POLISHING LIQUID SET, POLISHING LIQUID, AND METHOD FOR POLISHING SUBSTRATE BY USING THE SLURRY, THE SET, AND THE LIQUID |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a polishing liquid set which can exhibit an additional effect of an additive and by which a film to be polished can be polished at an excellent polishing rate, and to provide a polishing liquid.SOLUTION: A slurry polishing liquid contains an abrasive grain, the additive and water. The abrasive grain includes tetravalent cerium hydroxide particles. The aqueous dispersion, the abrasive grain content of which is adjusted to 1.0 mass%, exhibits 50%/cm or higher light transmittance to the light of 500 nm wavelength. Further, the slurry polishing liquid contains a dispersant such as a polyvinyl alcohol polymer, and has the pH of 2.0-9.0.</p> |
申请公布号 |
JP2015007236(A) |
申请公布日期 |
2015.01.15 |
申请号 |
JP20140146000 |
申请日期 |
2014.07.16 |
申请人 |
HITACHI CHEMICAL CO LTD |
发明人 |
IWANO TOMOHIRO;AKIMOTO HIROTAKA;NARITA TAKENORI;KIMURA TADAHIRO;RYUZAKI DAISUKE |
分类号 |
C09K3/14;B24B37/00;B24B37/04;H01L21/304 |
主分类号 |
C09K3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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