发明名称 温度変更システム
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a temperature change system which shortens the time required for temperature change of a bake plate part. <P>SOLUTION: A rapid temperature change (RTC) system includes a bake plate part 205 including a heat diffusion part 222, a heater base 226 connecting with the heat diffusion part 222, and a heater layer 224 connecting with the heater base 226. The rapid temperature change system includes a passive cooling mechanism disposed close to the bake plate part 205. The passive cooling mechanism moves so as to physically contact with the heater layer 224. The passive cooling mechanism includes a cooling plate 240 and a thermal pad 210 connecting with the cooling plate 240. Further, the rapid temperature change system includes an active cooling mechanism located close to the passive cooling mechanism. The passive cooling mechanism moves so as to physically contact with the active cooling mechanism. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5658083(B2) 申请公布日期 2015.01.21
申请号 JP20110106090 申请日期 2011.05.11
申请人 发明人
分类号 H01L21/027 主分类号 H01L21/027
代理机构 代理人
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