发明名称 可溶性イミド骨格樹脂、可溶性イミド骨格樹脂溶液組成物、硬化性樹脂組成物、およびその硬化物
摘要 <p>An imide skeleton resin represented by the following general formula (1) has a coefficient of linear expansion as low as that of polyimide resin and excellent processability like epoxy resin, and is useful as a resin composition for electrical laminates. Five percent by mole or more of the entirety of the A component is a linking group having an imide skeleton represented by the following general formula (4-1). B denotes a hydrogen atom or a group represented by the following structural formula (5). n denotes an integer in the range of 0 to 200. If both of the B's are hydrogen atoms, then n denotes an integer of 1 or more.</p>
申请公布号 JP5655284(B2) 申请公布日期 2015.01.21
申请号 JP20090182613 申请日期 2009.08.05
申请人 发明人
分类号 C08G59/06;C08G59/22;H05K1/03 主分类号 C08G59/06
代理机构 代理人
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