MULTILAYER PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board.SOLUTION: There is disclosed a multilayer printed circuit board which is formed by repeatedly laminating an insulation layer having a circuit wiring layer formed on one surface in order to reduce a size, weight and thickness of a substrate. The multilayer printed circuit board is disclosed including: a via electrode which is formed to penetrate through at least one or more insulation layers in a thickness direction; a via pad which is connected to an upper part or a lower part of the via electrode; and a pad for load formed at a position opposed to the via pad across at least one insulation layer.