WIRING BOARD, ELECTRONIC DEVICE USING THE SAME, AND MANUFACTURING METHOD OF WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To improve heat radiation of an electronic component and inhibit warpage in a wiring board where the electronic component including a heating element is mounted on the one surface side.SOLUTION: A glass cloth 41 is sealed by a resin 42 so as to have one surface 11 and the other surface 12. Through holes 41a are formed at a portion of the glass cloth 41 which is located below an electronic component 121 mounted on the one surface 11 and including a heating element. The resin 42, which is the same as the resin 42 sealing the glass cloth 41, is disposed in the through holes 41a.