Semiconductor Device and Method of Forming Through Mold Hole with Alignment and Dimension Control

摘要

A semiconductor device includes a semiconductor die and an encapsulant formed over a first surface of the semiconductor die and around the semiconductor die. A first insulating layer is formed over a second surface of the semiconductor die opposite the first surface. A plurality of conductive vias is formed through the first insulating layer. A conductive pad is formed over the encapsulant. An interconnect structure is formed over the semiconductor die and encapsulant. A first opening is formed in the encapsulant to expose the conductive vias. The conductive vias form a conductive via array. The conductive via array is inspected through the first opening to measure a dimension of the first opening and determine a position of the first opening. The semiconductor device is adjusted based on a position of the conductive via array. A conductive material is formed in the first opening over the conductive via array.

主权项

1. A method of making a semiconductor device, comprising:
providing a semiconductor die; depositing an encapsulant over a first surface of the semiconductor die and around the semiconductor die; forming a first insulating layer over a second surface of the semiconductor die opposite the first surface; forming a plurality of conductive vias through the first insulating layer; and forming a first opening in the encapsulant to expose the conductive vias.