PACKAGE STRUCTURE OF AN OPTICAL MODULE

摘要

This invention relates to an optical module package structure. A substrate is defined with a light receiving region and a light emitting region. A light receiving chip and a light emitting chip are disposed on the light receiving region and the light emitting region of the substrate, respectively. An electronic unit is disposed on the substrate and electrically connected to the light emitting chip. Two encapsulating gels are coated on each of the chips and the electronic unit. A cover is disposed on the substrate and has a light emitting hole and a light receiving hole, located above the light emitting chip and the light receiving chip, respectively. In this way, the package structure of the optical module of the present invention integrates passive components, functional ICs or dies into a module, and the optical module provides the functions of current limiting or function adjustment.

主权项

1. A package structure of an optical module, comprising:
a substrate being defined with a light receiving region and a light emitting region; a light receiving chip disposed on the light receiving region of the substrate; a light emitting chip disposed on the light emitting region of the substrate; an electronic unit disposed on the substrate and electrically connected to the light emitting chip; two encapsulating gels coated on the light receiving chip, the light emitting chip and the electronic unit; and a cover disposed on the substrate and having a light emitting hole and a light receiving hole, and the light emitting hole and the light receiving hole being located above the light emitting chip and the light receiving chip, respectively.