| 摘要 |
<p>A plastic-packaging intelligent power module and a radiator structure thereof. A radiator is integrated inside an intelligent power module through heat-conductive epoxy, one end of the radiator is embedded inside the intelligent power module, and the other end thereof is located outside the intelligent power module. The radiator structure of the plastic-packaging intelligent power module uses an integration design without designing grooves to fix screws, which increases the heat dissipation area of the intelligent power module, cancels radiation fins and a heat-conductive silicone grease layer, reduces heat transferring media, and improves the heat dissipation effect, thereby having good reliability and stability.</p> |
