发明名称 COMPOSITION FOR SELF-CURING MOLD
摘要 <p>PROBLEM TO BE SOLVED: To provide a composition for a self-curing mold which can improve curability in a deep part of a mold, a binder composition and a manufacturing method for the mold using those.SOLUTION: A composition for a self-curing mold is a mixture of heat resistant particles, a binder composition containing acid curing resin, and a curing agent. At least one kind of chemicals (A) selected from a divalent alcohol shown in a following general formula (1), a divalent alcohol containing an ether group shown in a following general formula (2) and a ketone shown in a following general formula (3) is contained at 0.0049 to 0.069 wt.% in the composition for the self-curing mold: (1) HO-R-OH; (2) HO-(RO)-H; and (3) R-CO-R.</p>
申请公布号 JP2015016509(A) 申请公布日期 2015.01.29
申请号 JP20140211507 申请日期 2014.10.16
申请人 KAO CORP 发明人 MATSUO TOSHIKI
分类号 B22C1/10;B22C1/22;C08K5/053;C08K5/06;C08K5/07;C08L101/00 主分类号 B22C1/10
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