| 摘要 |
The purpose of the present invention is to provide an electronic device that has excellent sealing properties and a high resistance to repetitive bending, and a method for manufacturing the same. Provided is an electronic device comprising a substrate, an electronic element body formed on the substrate, and a sealing substrate that is joined with the substrate via a junction, said junction being provided around the electronic element body, to seal the electronic element body, wherein the substrate and/or the sealing substrate comprise a gas barrier film, and the junction contains at least one member selected from the group consisting of iron, cobalt, nickel, ruthenium, rhodium, palladium, osmium, iridium and platinum. Also provided is a method for manufacturing the electronic device. |
