| 摘要 |
<p>The purpose of the present invention is to provide: an electronic component which includes a base comprising titanium-copper or Corson ally and an Au or Au-alloy coating film formed by plating, wherein the Au or Au-alloy coating film has few pinholes even when thin and the titanium-copper or Corson alloy is less apt to suffer corrosion or discoloration, resulting in excellent corrosion resistance; and a process for producing the electronic component. This electronic component is characterized by comprising: a base constituted of titanium-copper or Corson alloy; and three layers successively formed thereon by plating, i.e., an Ni coating film, a Pd-Ni coating film, and an Au or Au-alloy coating film. The electronic component is further characterized in that the surface of the Au or Au-alloy coating film has undergone electrodeposition of a pore-filling agent which contains a benzotriazole compound, a mercaptobenzothiazole compound, or a triazinethiol compound as an inhibitor.</p> |
