| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide polishing compositions and methods for planarizing or polishing memory or rigid disks which minimize microwaviness and edge roll-off, without sacrificing the removal rate of the memory or rigid disks.SOLUTION: The invention provides a chemical-mechanical polishing composition comprising alpha alumina, fumed alumina, silica, an oxidizing agent that oxidizes nickel-phosphorous, a complexing agent, and water. The invention also provides a method of chemically-mechanically polishing a substrate comprising contacting a substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.</p> |
