发明名称 PROCESSING DEVICE FOR ALIGNED SUBSTRATE
摘要 <p>PROBLEM TO BE SOLVED: To provide a processing device for an aligned substrate that can efficiently and securely remove an end material part covering a terminal region.SOLUTION: A processing device for an aligned substrate M which has a first substrate G1 and a second substrate G2 stuck together while a scribe line S3 for forming a terminal region T is formed at a part close to at least one side part of the first substrate G1 and an end material part E covering the terminal region T is to be removed along the scribe line S3, comprises: a conveyor 11 which mounts the aligned substrate M thereon and conveys the aligned substrate M; and an abutting body 12 which can move forward and backward to abut on a surface of the end material part E of the aligned substrate conveyed by the conveyor 11. The conveyor 11 conveys the end material part E of the aligned substrate to nearby the abutting body 12, and the remaining part of the aligned substrate is moved in a direction away from the abutting body 12 while the abutting body 12 is made to abut on the end material part E so as to remove the end material part E.</p>
申请公布号 JP2015017015(A) 申请公布日期 2015.01.29
申请号 JP20130145394 申请日期 2013.07.11
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 TOMINAGA KEISUKE
分类号 C03B33/03;B28D1/24 主分类号 C03B33/03
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