| 发明名称 |
METHOD FOR PROCESSING A WORKPIECE |
| 摘要 |
A method for processing a workpiece may include: providing a workpiece including a first region and a second region; forming a porous metal layer over the first region and the second region; wherein the first region and the second region are configured such that an adhesive force between the second region and the porous metal layer is lower than an adhesive force between the first region and the porous metal layer. |
| 申请公布号 |
US2015031203(A1) |
申请公布日期 |
2015.01.29 |
| 申请号 |
US201313948208 |
申请日期 |
2013.07.23 |
| 申请人 |
Infineon Technologies AG |
发明人 |
KRENZER Michael;KUNSTMANN Thomas;HESS Eva-Maria;FRANK Manfred |
| 分类号 |
H01L21/285;H01L21/02 |
主分类号 |
H01L21/285 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for processing a workpiece, the method comprising:
providing a workpiece comprising a first region and a second region; forming a porous metal layer over the first region and the second region; wherein the first region and the second region are configured such that an adhesive force between the second region and the porous metal layer is lower than an adhesive force between the first region and the porous metal layer. |
| 地址 |
Neubiberg DE |
