MODULAR CUTTING SYSTEM, METHOD AND APPARATUS

摘要

A system, a method and a modular apparatus may use a wire loop to cut an object. The apparatus may have a wire loop connected to pulleys on a deck attached to a frame. The deck may move relative to the frame to direct the wire loop through the object. The apparatus may have arms that may hold the object being cut. The apparatus may be configured with different cutting decks to reduce the overall size of the apparatus and/or to facilitate cutting a particular object in a particular environment.

主权项

1. A modular cutting apparatus comprising:
a frame having a first end and a second end located opposite to the first end; a feed plate connected to the frame; a first deck having a wire attached to a first pulley and a second pulley wherein the wire travels through the first pulley and the second pulley wherein the first deck has a first circumference; and a second deck having a wire attached to a first pulley and a second pulley wherein the wire travels through the first pulley and the second pulley wherein the second deck has a second circumference wherein the second circumference is different than the first circumference wherein the first deck and the second deck are interchangeably connected to the feed plate and further wherein the feed plate moves relative to the frame from a first position at the first end of the frame to a second position at the second end of the frame.