| 摘要 |
The present invention relates to a TO can-type optical module for ultrahigh-speed communication comprising a laser diode chip for ultrahigh-speed communication of 5Gbps or higher. An optical module for ultrahigh-speed communication according to the present invention comprises: a laser diode chip; a high-speed signal transmission substrate for transmitting signals; an upper high-speed signal transmission substrate (210) having a high-speed signal transmission line pattern formed thereon; and a lower high-speed signal transmission substrate (220) having a conductive upper surface, the substrates being coupled to the laser diode chip. The optical module has single-ended impedance of 25ohm or differential-ended impedance of 50ohm, thereby enabling high-speed transmission; the substrate, to which a laser diode chip for high-speed communication is attached, has a height of about 0.4mm, thereby facilitating optical coupling between the laser diode chip and a lens, etc.; and a high-speed transmission line is implemented using a substrate width of 0.6mm or less, thereby providing a high-speed signal transmission substrate that is effectively embedded in a TO can-type package having a narrow mounting area. |
