| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing that has a low chlorine content, is excellent in storage stability and continuous moldability, permits a reduction in corrosion of a joined part of an electrode pad and a metal wire on a semiconductor element and corrosion of a wiring part of the semiconductor element under high temperature and high humidity conditions and achieves improvement in reliability of a semiconductor device, and to provide a semiconductor device having a semiconductor element sealed with a cured product of the epoxy resin composition for sealing.SOLUTION: The epoxy resin composition for sealing comprises (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler. The epoxy resin (A) is a mixture of resins each having, in one molecule, a glycidyl ether group and at least either one of an allyl ether group and a phenolic hydroxyl group and having the same basic skeleton different in substituent and has three kinds of the glycidyl ether group, the allyl ether group and the phenolic hydroxyl group in the whole mixture. |
