| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition and a photosensitive element having good adhesiveness and resolution and giving a flexible photosensitive layer after exposure, and to provide a method for forming a resist pattern and a method for manufacturing a printed wiring board using the photosensitive resin composition or the photosensitive element.SOLUTION: The photosensitive resin composition comprises (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond, and (C) a photopolymerization initiator. The (A) component comprises (a1) 55 to 75 mass% of a structural unit derived from a benzyl (meth)acrylate derivative, (a2) 5 to 15 mass% of a structural unit derived from a styrene derivative, and (a3) 10 to 30 mass% of a structural unit derived from a (meth)acrylic acid. |
