发明名称 CHIP REMOVAL DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a chip removal device which removes efficiently chips adhered to cut parts of materials cut in the same specified shape and their vicinity in producing a variety of sheet-like materials and supplying to the market.SOLUTION: A chip removal device includes conveyance means 2, 3, 5 and 6 of cutting a sheet-like material in the same specified shape and conveying a bound bundle 7 formed by aligning the cut parts in the side surface and a removal device body 4 which sucks chips from the bound bundle 7 for removal when the bound bundle 7 conveyed by the conveyance means 2, 3, 5 and 6 is located in a space formed by a plurality of suction blocks 10a, 10b, 10c and 10d connected to a vacuum suction device.</p>
申请公布号 JP2015016629(A) 申请公布日期 2015.01.29
申请号 JP20130145083 申请日期 2013.07.11
申请人 KAWAKAMI SANGYO CO LTD 发明人 YUI MASAMITSU;ICHIKAWA ICHIRO
分类号 B29C71/00 主分类号 B29C71/00
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