发明名称 |
PACKAGE STRUCTURE OF OPTICAL MODULE |
摘要 |
A package structure of an optical module includes: a substrate having a frame defined with a light-emitting region and a light-admitting region; a light-emitting chip disposed at the light-emitting region of the substrate; a light-admitting chip disposed at the light-admitting region of the substrate; two encapsulants formed in the frame and enclosing the light-emitting chip and the light-admitting chip, respectively; and a shielding layer formed on the frame and the encapsulants and having a light-emitting hole and a light-admitting hole, wherein the light-emitting hole and the light-admitting hole are positioned above the light-emitting chip and the light-admitting chip, respectively. The optical module package structure uses an opaque glue to reduce costs and total thickness of the package structure. |
申请公布号 |
US2015028378(A1) |
申请公布日期 |
2015.01.29 |
申请号 |
US201314072320 |
申请日期 |
2013.11.05 |
申请人 |
Lingsen Precision Industries, Ltd. |
发明人 |
TU Ming-Te;YEH Yao-Ting |
分类号 |
H01L33/48;H01L33/52;H01L33/00 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
1. A package structure of an optical module, comprising:
a substrate having a frame defined with a light-emitting region and a light-admitting region; a light-emitting chip disposed at the light-emitting region of the substrate; a light-admitting chip disposed at the light-admitting region of the substrate; two encapsulants formed in the frame and enclosing the light-emitting chip and the light-admitting chip, respectively; and a shielding layer formed on the frame and the encapsulants and having a light-emitting hole and a light-admitting hole, wherein the light-emitting hole and the light-admitting hole are positioned above the light-emitting chip and the light-admitting chip, respectively. |
地址 |
Taichung City TW |