| 发明名称 |
SYSTEM AND METHOD FOR LEAD FRAME PACKAGE DEGATING |
| 摘要 |
A method of forming an electronic component includes masking a lead frame to form a mask defining an exposed area, oxidizing the exposed area of the lead frame, wherein the mask inhibits oxidation of an unexposed area, and removing the mask from the lead frame following oxidizing. A lead frame can include a metal sheet patterned to define a pad region and leads. The metal sheet includes metal oxide in a select area. The pad region is substantially free of metal oxide. |
| 申请公布号 |
US2015027767(A1) |
申请公布日期 |
2015.01.29 |
| 申请号 |
US201313950618 |
申请日期 |
2013.07.25 |
| 申请人 |
Chopin Sheila F.;Mathew Varughese |
发明人 |
Chopin Sheila F.;Mathew Varughese |
| 分类号 |
H01L21/56;H01L21/48;H01L23/495 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of forming an electronic component, the method comprising:
masking a lead frame to form a mask defining an exposed area; oxidizing the exposed area of the lead frame, wherein the mask inhibits oxidation of an unexposed area; and removing the mask from the lead frame following oxidizing. |
| 地址 |
Round Rock TX US |
