| 发明名称 |
METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD |
| 摘要 |
A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F. |
| 申请公布号 |
US2015027627(A1) |
申请公布日期 |
2015.01.29 |
| 申请号 |
US201414513421 |
申请日期 |
2014.10.14 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE Yang Je;SHIN Jae Ho;YANG Dek Gin |
| 分类号 |
H05K3/00;H05K3/02 |
主分类号 |
H05K3/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a rigid-flexible printed circuit board, which comprises:
providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F. |
| 地址 |
Suwon KR |
