| 摘要 |
PROBLEM TO BE SOLVED: To enhance temperature uniformity in a ceramic heater including an inner peripheral side resistance heater and an outer peripheral side resistance heater.SOLUTION: First and second conductive surfaces 30a, 30b are embedded independently in a plane P2 different from a plane P1, where an inner peripheral side resistance heater 20 and an outer peripheral side resistance heater 24 are formed, so as to overlap the inner peripheral side resistance heater 20. The plane P2 is located between the plane P1 and a wafer mounting surface 12a. One end 24a of the outer peripheral side resistance heater 24 is connected with an outer peripheral side power supply terminal 28a via a connection terminal 26a and the first conductive surface 30a, and the other end 24b of the outer peripheral side resistance heater 24 is connected with an outer peripheral side power supply terminal 28b via a connection terminal 26b and the second conductive surface 30b. |
