发明名称 COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a component mounting device capable of improving productivity of a substrate by improving imaging accuracy when an image of each component sucked by each suction nozzle in two nozzle rows of a mounting head is picked up from a side, and reducing an imaging time.SOLUTION: The component mounting device comprises: a first side imaging camera 26a for focusing on a first position P1 through which a component 3 sucked by each suction nozzle 22 constituting one of two front and rear nozzle rows of a mounting head 21 moving toward a first component recognition camera 24a passes, and picking up the image of the component 3 passing through the first position P1 from the side; and a second side imaging camera 27a for focusing on a second position P2 through which the component 3 sucked by each suction nozzle 2 constituting the other of the two nozzle rows passes, and picking up the image of the component 3 passing through the second position P2 from the side.
申请公布号 JP2015018992(A) 申请公布日期 2015.01.29
申请号 JP20130146131 申请日期 2013.07.12
申请人 PANASONIC IP MANAGEMENT CORP 发明人 OTA HIROSHI;NAKAI NOBUHIRO;NAGAYA TOSHIHIKO;OKADA KOICHI;MORI HIDEO
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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