发明名称 Chemical Fluid Processing Apparatus and Chemical Fluid Processing Method
摘要 A chemical fluid processing apparatus and a chemical fluid processing method are described, to treat a substrate with a plurality of chemical fluids such that substantially constant temperature is maintained across a substrate surface. The apparatus includes a discharge nozzle above the substrate to supply a first chemical fluid at a first temperature to a front surface of the substrate, a bar nozzle oriented in a radial direction of the substrate to supply a second chemical fluid at a second temperature to the front surface or a back surface of the substrate, the second temperature being higher than the first temperature, and where the bar nozzle includes a plurality of outlets for discharging the second chemical fluid to a plurality of contacting places on the front surface or the back surface of the substrate at different distances from the center of the substrate.
申请公布号 US2015031214(A1) 申请公布日期 2015.01.29
申请号 US201414338656 申请日期 2014.07.23
申请人 Tokyo Electron Limited 发明人 Bassett Derek W;Printz Wallace P;Goshi Gentaro;Kawano Hisashi;Kai Yoshihiro
分类号 H01L21/67;H01L21/306 主分类号 H01L21/67
代理机构 代理人
主权项 1. A chemical fluid processing apparatus to treat a substrate with a plurality of chemical fluids such that substantially constant temperature is maintained across a substrate surface, the apparatus comprising: a substrate holding mechanism to hold the substrate; a rotating mechanism to rotate the substrate holding mechanism; a discharge nozzle above the substrate to supply a first chemical fluid at a first temperature to a front surface of the substrate; a first chemical fluid supply mechanism to supply the first chemical fluid to the discharge nozzle; a bar nozzle oriented in a radial direction of the substrate to supply a second chemical fluid at a second temperature to the front surface or a back surface of the substrate, the second temperature being higher than the first temperature; and a second chemical fluid supply mechanism to supply the second chemical fluid to the bar nozzle, wherein the bar nozzle comprises a plurality of outlets for discharging the second chemical fluid to a plurality of contacting places on the front surface or the back surface of the substrate at different distances from the center of the substrate.
地址 Tokyo JP