发明名称 |
Chemical Fluid Processing Apparatus and Chemical Fluid Processing Method |
摘要 |
A chemical fluid processing apparatus and a chemical fluid processing method are described, to treat a substrate with a plurality of chemical fluids such that substantially constant temperature is maintained across a substrate surface. The apparatus includes a discharge nozzle above the substrate to supply a first chemical fluid at a first temperature to a front surface of the substrate, a bar nozzle oriented in a radial direction of the substrate to supply a second chemical fluid at a second temperature to the front surface or a back surface of the substrate, the second temperature being higher than the first temperature, and where the bar nozzle includes a plurality of outlets for discharging the second chemical fluid to a plurality of contacting places on the front surface or the back surface of the substrate at different distances from the center of the substrate. |
申请公布号 |
US2015031214(A1) |
申请公布日期 |
2015.01.29 |
申请号 |
US201414338656 |
申请日期 |
2014.07.23 |
申请人 |
Tokyo Electron Limited |
发明人 |
Bassett Derek W;Printz Wallace P;Goshi Gentaro;Kawano Hisashi;Kai Yoshihiro |
分类号 |
H01L21/67;H01L21/306 |
主分类号 |
H01L21/67 |
代理机构 |
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代理人 |
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主权项 |
1. A chemical fluid processing apparatus to treat a substrate with a plurality of chemical fluids such that substantially constant temperature is maintained across a substrate surface, the apparatus comprising:
a substrate holding mechanism to hold the substrate; a rotating mechanism to rotate the substrate holding mechanism; a discharge nozzle above the substrate to supply a first chemical fluid at a first temperature to a front surface of the substrate; a first chemical fluid supply mechanism to supply the first chemical fluid to the discharge nozzle; a bar nozzle oriented in a radial direction of the substrate to supply a second chemical fluid at a second temperature to the front surface or a back surface of the substrate, the second temperature being higher than the first temperature; and a second chemical fluid supply mechanism to supply the second chemical fluid to the bar nozzle, wherein the bar nozzle comprises a plurality of outlets for discharging the second chemical fluid to a plurality of contacting places on the front surface or the back surface of the substrate at different distances from the center of the substrate. |
地址 |
Tokyo JP |