| 发明名称 |
CIRCUIT MATERIALS, CIRCUITS LAMINATES, AND METHOD OF MANUFACTURE THEREOF |
| 摘要 |
A circuit subassembly is disclosed comprising a conductive metal layer and a dielectric substrate layer having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006 at 10 GHz, wherein the composition of the dielectric substrate layer comprises about 5 to about 70 volume percent of borosilicate microspheres that have been treated with an alkaline solution. |
| 申请公布号 |
US2015030824(A1) |
申请公布日期 |
2015.01.29 |
| 申请号 |
US201414334876 |
申请日期 |
2014.07.18 |
| 申请人 |
Rogers Corporation |
发明人 |
Crosley Jessica |
| 分类号 |
H05K1/03;H05K3/46;H05K3/00;H05K1/02 |
主分类号 |
H05K1/03 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit subassembly, comprising
a conductive layer disposed on a dielectric substrate layer, wherein the composition of the dielectric substrate layer comprises, based on the volume of the dielectric substrate layer: about 30 to about 90 volume percent of a polymer matrix material; and about 5 to about 70 volume percent of hollow borosilicate microspheres wherein the borosilicate microspheres are a product of a process of subjecting the borosilicate microspheres to an alkaline solution; and wherein the dielectric substrate layer has a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006 at 10 GHz. |
| 地址 |
Rogers CT US |
