| 发明名称 |
MOLDING COMPOSITION FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME |
| 摘要 |
Disclosed herein are a molding composition for a semiconductor package including a liquid crystal thermosetting polymer resin and graphene oxide to thereby effectively decrease coefficient of thermal expansion (CTE) and warpage and maximize an effect of thermal conductivity, and a semiconductor package using the same. |
| 申请公布号 |
US2015028498(A1) |
申请公布日期 |
2015.01.29 |
| 申请号 |
US201414290628 |
申请日期 |
2014.05.29 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
Ji Soo Young;Kim Seung Hwan |
| 分类号 |
H01L23/29;H01L23/00;C08L63/04;C08L67/02;C08K3/20;C08L63/00 |
主分类号 |
H01L23/29 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A molding composition for a semiconductor package comprising:
a liquid crystal thermosetting polymer resin; and graphene oxide. |
| 地址 |
Suwon-Si KR |
