| 摘要 |
Disclosed is a soldering apparatus, which is capable of maintaining the inside of a chamber under predetermined vacuum pressure, and is capable of performing soldering in the chamber under optimally adjusted vacuum pressure. As shown in Fig. 4, the soldering apparatus is provided with: a chamber (40) for soldering a workpiece (1) under vacuum environment; an operating section (21) for inputting and setting vacuum pressure inside of the chamber (40); a pump (23) that evacuates the inside of the chamber (40); a pressure sensor (24) that detects pressure inside of the chamber (40); and a control section (61) for adjusting set vacuum pressure on the basis of pressure detection signals (S24) inside of the chamber (40), said signals having been outputted from the pressure sensor (24), and for maintaining the set vacuum pressure for a predetermined time. |
