DOUBLE-SIDE POLISHING APPARATUS

摘要

A wafer polishing apparatus configured to polish simultaneously both surfaces of a wafer by pressing and rubbing the wafer, while holding the wafer with: a lower turn table having a flat polishing-upper-surface rotationally driven; an upper turn table having a flat polishing-lower-surface rotationally driven, the upper turn table being arranged with facing to the lower turn table; and a carrier having a wafer-holding bole for holding the wafer, wherein the polishing is performed while measuring a thickness of the wafer through a plurality of openings provided between a rotation center and an edge of the upper turn table or the lower turn table, and switching a polishing slurry with a polishing slurry having a different polishing rate during the polishing of the wafer. As a result, the wafer polishing apparatus can manufacture a wafer having a high flatness and a high smoothness at high productivity and high yield.

主权项

1. A double-side polishing apparatus including at least: a lower turn table having a flat polishing-upper-surface rotationally driven; an upper turn table having a flat polishing-lower-surface rotationally driven, the upper turn table being arranged with facing to the lower turn table; and a carrier having a wafer-holding hole for holding a wafer, the apparatus comprising
a plurality of openings provided between a rotation center and an edge of the upper turn table or the lower turn table, and a wafer-thickness-measuring mechanism for measuring a thickness of the wafer through the plurality of openings during polishing in real time, the apparatus wherein the wafer-thickness-measuring mechanism is fixed to a fixed end except the upper turn table and the lower turn table of the double-side polishing apparatus.