SEMICONDUCTOR DEVICES

摘要

A semiconductor device includes: a chip having at least one electrically conductive contact at a first side of the chip; an extension layer extending laterally from one or more sides of the chip; a redistribution layer on a surface of the extension layer and the first side, and coupled to the contact; an interposer having at least one electrically conductive contact at a first surface of the interposer and coupled to the redistribution layer, and at least one electrically conductive contact at a second surface of the interposer opposite to the first surface; a molding material at least partially enclosing the chip and the redistribution layer, and in contact with the interposer. Another semiconductor device includes: an interposer; a redistribution layer over the interposer; a circuit having first and second circuit portions, wherein the redistribution layer includes the first circuit portion, and the interposer includes the second circuit portion.

主权项

1. A semiconductor device, comprising:
a first semiconductor chip having at least one electrically conductive contact at a first side of the first semiconductor chip; an extension layer extending laterally from one or more sides of the first semiconductor chip; a redistribution layer disposed on a surface of the extension layer and the first side of the first semiconductor chip, the redistribution layer being electrically coupled to the at least one electrically conductive contact of the first semiconductor chip; an interposer having at least one electrically conductive contact at a first surface of the interposer and at least one electrically conductive contact at a second surface of the interposer opposite to the first surface of the interposer, the at least one electrically conductive contact at the first surface of the interposer being electrically coupled to the redistribution layer; and a molding material at least partially enclosing the first semiconductor chip and the redistribution layer, and in contact with the interposer.