| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure and a manufacturing method of an imaging unit which prevent adhesive strength between a printed wiring board and a translucent member from being deteriorated by air bubbles in an adhesive.SOLUTION: An imaging unit according to one embodiment of the invention includes: a printed wiring board 3 where an opening part 3a is formed corresponding to a light receiving part 2a of a solid state image sensor 2; an adhesive 6 which is applied to a substrate surface opposite to a mounting surface of the printed wiring board 3; and a translucent member 5 with a hole where a through hole 5a is formed in a region enclosed by an adhesive region C1 adhering to the printed wiring board 3. The solid state image sensor is mounted on the printed wiring board 3 in a manner that the light receiving part 2a faces the opening part 3a. The adhesive 6 is applied so as to enclose the opening part 3a. The translucent member 5 with the hole is adhered to the printed wiring board 3 penetrating the adhesive 6 into the adhesive region C1. |
