| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition suitable for the formation of an interlayer insulating film having high heat resistance, high solvent resistance, high transmittance and a low dielectric constant, and having a large development margin that allows formation of a favorable pattern even when a developing time exceeds the optimal developing time in a developing process. <P>SOLUTION: A positive photosensitive resin composition contains: a polysiloxane compound having a carboxyl group and/or a phenolic hydroxyl group as a base resin; a photosensitive diazoquinone compound as a photosensitive component; an organic solvent; and a hydrolyzed condensate of an alkyl silane compound expressed by a general formula (1) and an aryl silane compound expressed by a general formula (2). <P>COPYRIGHT: (C)2012,JPO&INPIT |
