| 摘要 |
<p>The present invention provides a light emitting diode and a light emitting device package. According to an embodiment of the present invention, the light emitting diode includes: a supporting member; a light emitting structure which is disposed on the supporting member, and includes first and second conductive semiconductor layers, and an active layer which is disposed between the first and second conductive semiconductor layers; a first electrode which is connected electrically to the first semiconductor layer; a second electrode which is disposed under the light emitting structure and is connected electrically to the second conductive semiconductor; an adhesive layer which is disposed on the light emitting structure; and a light transparent unit which is disposed on the adhesive layer.</p> |
