发明名称 PRESSURE SENSITIVE ADHESIVE COMPOSITIONS, PRESSURE SENSITIVE ADHESIVE FILM AND METHOD FOR MANUFACTURING ORGANIC ELECTRONIC DEVICE USING THE SAME
摘要 The present invention relates to adhesive compositions, an adhesion film, and a method for manufacturing an organic electronic device using the same. More specifically, provided are adhesive compositions which can effectively block moisture or oxygen introduced from the outside to an organic electronic device, and can show reliability in severe conditions such as high temperature and humidity, and excellent optical characteristic. Also, provided is an adhesion film comprising the same.
申请公布号 KR20150016920(A) 申请公布日期 2015.02.13
申请号 KR20140100665 申请日期 2014.08.05
申请人 发明人
分类号 C09J4/02;C09J7/02;C09J11/06;C09J123/00;H01L51/56 主分类号 C09J4/02
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