| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin sheet which excels in handling properties and flowability on molding and makes a resin layer having a low linear expansion coefficient and a low water absorption, a printed-wiring board using the resin sheet which can form a thin and fine wiring circuit having excellent reliability, and furthermore a semiconductor device using the printed-wiring board having excellent reliability. <P>SOLUTION: The resin sheet is obtained by forming a resin layer composed of a resin composition having (A) a dicyclopentadiene type cyanate resin, (B) an epoxy resin, and (C) an inorganic filler as essential components on a base material. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
