Thermally optimized mechanical interface for hybrid integrated wavelength division multiplexed arrayed transmitter

摘要

An apparatus comprising a plurality of laser dice and a heat sink positioned between the laser dice and thermally coupled to the laser dice. Also included is an apparatus comprising a chip comprising a laser core, a stopper at least partially defining a groove, wherein the stopper and the groove are positioned adjacent to the chip, and a heater located between the laser core and the groove.

主权项

1. An apparatus comprising:
a chip comprising:
a first plane defined by a bottom major surface on the chip; anda plurality of light-emitting laser cores comprising a first laser core and a second laser core, wherein there is no air gap or thermal insulation directly between the laser cores; an electrode electrically coupled to the first laser core; a substrate having a second plane defined by a top major surface on the substrate, wherein the first plane and the second plane are substantially parallel; a heat sink positioned between the first laser core and the second laser core, wherein the heat sink is thermally coupled to the first laser core and the second laser core and bonds the substrate and the chip, and wherein the electrode does not contact the heat sink; and a plurality of stoppers comprising a first stopper and a second stopper, wherein the first stopper is positioned on a first side of the heat sink and the second stopper is positioned on a second side of the heat sink, wherein at least part of the first stopper is positioned between the first laser core and the heat sink, and wherein at least part of the second stopper is positioned between the second laser core and the heat sink.