| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in moldability, wherein a molded product can be provided which has high heat conductivity and low thermal expansion and is excellent in heat resistance and moisture resistance; and to provide the molded product obtained by using the same. <P>SOLUTION: The epoxy resin composition consists mainly of an epoxy resin (A) and a curing agent (B). In an epoxy resin component, an epoxy resin having 4,4'-diphenylmethane structure is used, wherein the epoxy resin accounts for 75 wt.% of the epoxy resin component. In a curing agent component, a phenolic resin having the 4,4'-diphenylmethane structure is used, wherein the phenolic resin accounts for 75 wt.% of the curing agent component. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
