| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a power module which can control an inclination and a location of a semiconductor element easily and at low cost. <P>SOLUTION: A power module according to the present invention comprises a surface side solder layer 45 formed between a surface electrode 25 and a second electrode pad 5a of a semiconductor element 20, and a rear face side solder layer 43 formed between a back electrode 23 and a first electrode pad 3a. The first and the second electrode pads 3a, 5a each includes a part having substantially the same shape as that of the corresponding back electrode 23 or the corresponding surface electrode 25, and four projecting parts projecting outward by a distance D<SB POS="POST">1</SB>from a location corresponding to four corners of the part along a diagonal line of the semiconductor element 20. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
