发明名称 発光装置及びその製造方法
摘要 <P>PROBLEM TO BE SOLVED: To provide a light emitting device having high reliability. <P>SOLUTION: A light emitting device comprises: at least one pair of lead frames each having a plating layer on the surface thereof, which are disposed via a resin molding; and light emitting elements electrically connected with the lead frames. In the light emitting device, the plating layer has a ground layer and a surface layer laminated so as to partially expose a top face of the ground layer, and the ground layer is exposed at a position spaced apart from the resin molding. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5682341(B2) 申请公布日期 2015.03.11
申请号 JP20110019352 申请日期 2011.02.01
申请人 发明人
分类号 H01L33/62 主分类号 H01L33/62
代理机构 代理人
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