发明名称 チップ中間接続層の振動型MEMS共振器を使用した温度センサー
摘要 <p>Methods and apparatuses for Micro-Electro-Mechanical Systems (MEMS) resonator to monitor temperature in an integrated circuit. Fabricating the resonator in an interconnect layer provides a way to implement thermal detection means which is tolerant of manufacturing process variations. Sensor readout and control circuits can be on silicon if desired, for example, a positive feedback amplifier to form an oscillator in conjunction with the resonator and a counter to count oscillator frequency.</p>
申请公布号 JP5687711(B2) 申请公布日期 2015.03.18
申请号 JP20120545983 申请日期 2010.11.30
申请人 发明人
分类号 G01K5/60;B81B3/00;B81B7/02 主分类号 G01K5/60
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