发明名称 半硬化物、硬化物およびそれらの製造方法、光学部品、硬化樹脂組成物
摘要 <p>A heat-resistant cured product is efficiently produced by obtaining a semi-cured product where a curable resin composition containing a (meth)acrylate monomer, a non-conjugated vinylidene group-containing compound and a thermal radical-polymerization initiator is processed by at least one of photoirradiation and heating to give a semi-cured product having a complex viscosity of from 105 to 108 mPa·s at 25° C. and at a frequency of 10 Hz; and putting the semi-cured product in a forming die for pressure formation therein, and heating it therein for thermal polymerization to give a cured product.</p>
申请公布号 JP5685149(B2) 申请公布日期 2015.03.18
申请号 JP20110125542 申请日期 2011.06.03
申请人 发明人
分类号 C08F2/00;B29C43/02;C08F220/10;G02B1/04 主分类号 C08F2/00
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