| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To control propagation of noise through a guard ring provided between two element regions. <P>SOLUTION: A semiconductor chip 100 includes a logic part and an analog part 153. Moreover, the semiconductor chip 100 is constituted with a silicon substrate 101, a first insulating film 123 to a sixth insulating film 143 provided on the silicon substrate 101, and an annular seal ring 105 which is constituted by a first conductive ring 125 to a sixth conductive ring 145 embedded in the first insulating film 123 to the sixth insulating film 143 for surrounding the external circumference of the logic part and analog part 153. In addition, a pn-junction part functioning as a non-conductive part 104 is provided for blocking conductivity of the path extended to the analog part 153 from the logic part via the seal ring 105 within a seal ring region 106. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
