| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed board with a novel structure, capable of easily connecting an electronic component to be mounted on a surface thereof with a conductor pattern for a high current even when the conductor pattern is provided on an inner layer thereof, and excellent in maintainability.SOLUTION: A printed board includes an insulating substrate 58 and a thick copper foil pattern 64 for a high current provided on an inner layer 62 of the insulating substrate 58. In the printed board, an exposed part 84 which is formed by cutting the insulating layer to expose the thick copper foil pattern 64 on the inner layer 62 is provided in a surface layer 60 on at least one of front and rear surfaces of the insulating substrate 58, and a connection terminal 38 of an electronic component 34 is fastened and affixed to the exposed part 84 by fastening parts 94, 96.</p> |
