发明名称 SHEET STICKING DEVICE, AND SHEET STICKING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To surely stick an adhesive sheet to an adherend by suppressing the reduction in processing capacity per unit time and the stress from being given to the adherend as much as possible, and preventing the shortage of pressing force of an outer edge region in an overlapping region.SOLUTION: In a sheet sticking device 10, on a surface to be stuck of a wafer WF, an adhesive surface of an adhesive sheet AS is oppositely arranged in a predetermined sticking space SP1, and a pressing force in a direction to relatively approach each other is applied to the wafer WF and the adhesive sheet AS, thereby sticking the adhesive sheet AS to the surface to be stuck. The sheet sticking device includes: pressing means 20 which has a deformable deformation member 21 and in which the deformation member 21 is deformed to press the adhesive sheet AS to the surface to be stuck by making an airtight space SP2 holding the deformation member 21 therebetween and located on the side opposite to the sticking space SP1 have a higher pressure than the airtight space SP1; and re-pressing means 30 which has an annular pressing surface 31A and presses an outer edge region of an overlapping region AW where the adhesive sheet AS and the wafer WF are overlapped on each other separately from the pressing means 20.</p>
申请公布号 JP2015053377(A) 申请公布日期 2015.03.19
申请号 JP20130185098 申请日期 2013.09.06
申请人 LINTEC CORP 发明人 KUROSAWA YUTA
分类号 H01L21/683 主分类号 H01L21/683
代理机构 代理人
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