| 摘要 |
<p>PROBLEM TO BE SOLVED: To arrange a wiring in higher density in plate thickness direction, with a high aspect ratio.SOLUTION: There are provided a first insulating layer, a second insulating layer positioned in lamination on the first insulating layer, a wiring pattern of an inner layer containing a component connecting land and a substrate connecting land, pinched between the first insulating layer and the second insulating layer, a component which contains a terminal electrode and is electrically connected to the component connecting land of the wiring pattern and is embedded in the second insulating layer, a substrate in which a connected land which is electrically connected to the substrate connecting land of the wiring pattern and is embedded in the second insulating layer, being electrically conductive to the substrate connecting land through solder, is provided on one main surface, and, the conductive pattern is, from the connected land, extended as far as the other main surface through a side wall surface from one main surface, and an interlayer connection conductor provided on the conductive pattern which is on the other main surface of the substrate so as to penetrate a part of the second insulating layer in thickness direction.</p> |
