| 摘要 |
PROBLEM TO BE SOLVED: To provide a multiple piece forming wiring board in which variation in plating thickness between wiring conductors can be suppressed between a plurality of wiring board regions.SOLUTION: The multiple piece forming wiring board comprises: a mother board 1 having a plurality of square-shape wiring board regions 2 arrayed; a plurality of wiring conductors 3 that are respectively provided between adjacent wiring board regions 2 beyond the boundaries of the wiring board regions 2, arrayed along the boundaries and covered with plating layers; connecting conductors 4 that are provided across one ends and the other ends of the boundary parts along the boundaries of the wiring board regions 2 and electrically connect the plurality of wiring conductors 3 sequentially beyond the boundaries between adjacent wiring conductors 3; and parallel conductors 5 that are connected in parallel with the connecting conductors 4 between the one ends and the other ends of the boundary parts of the wiring board regions 2, where electric resistance of the parallel conductors 5 is smaller than electric resistance of the connecting conductors 4. |
