| 摘要 |
PURPOSE:To merely pressurize at the time of mounting and to simplify maintenance, regulation, etc., by making resin containing a microcapsule exist between a semiconductor element and a wiring board. CONSTITUTION:After the electrode pad 5 of a semiconductor element 6 is covered with metal, a metallic bump 4 is formed, and a wiring board 1 is formed with a wiring pattern 2 corresponding to the bump 4 of the element 6. The board 1 or the face formed with the bump 4 is coated with or mounted with resin 3. The resin 3 is liquid or sheetlike state, and microcapsules 7 containing curing agent is dispersed in the resin 3. Then, the bump 4 on the element 6 is aligned with the pattern 2 on the board 1, and both are pressurized in contact with one another. Thus, the bump 4 is electrically connected to the pattern 2, and they are continuously secured while the connection remains. |
