Light Emitting Device Substrate and Method for Manufacturing the Same

摘要

This invention relates to an optical device, more particularly, to a method for manufacturing an optical device substrate in which an optical device can be arranged in a various manner. The method includes manufacturing a plurality of unit block substrates by stacking n (n>1) number of flat panel metal substrates and cutting a first metal substrate-bonded body made by forming insulating members between stacked surfaces of the flat panel metal substrates such that each unit block substrate is partitioned into n number of optical device attachment areas by (n−1) number of the insulating members; manufacturing a second metal substrate-bonded body by stacking at least m (m>1) number of the unit block substrates in a manner that the insulating members are oriented in a vertical direction, inserting at least one of the insulating members and metal electrode substrates between the stacked surfaces, and bonding the metal electrode substrates onto a top and a bottom of the second metal substrate-bonded body; and manufacturing the optical device substrate by cutting the second metal substrate-bonded body from the top to the bottom such that each cut surface has m×n number of the optical device attachment areas.

主权项

1. A method of manufacturing an optical device substrate, comprising:
manufacturing a plurality of unit block substrates by stacking n (n>1) number of flat panel metal substrates and cutting a first metal substrate-bonded body made by forming insulating members between stacked surfaces of the flat panel metal substrates such that each unit block substrate is partitioned into n number of optical device attachment areas by (n−1) number of the insulating members; manufacturing a second metal substrate-bonded body by stacking at least m (m>1) number of the unit block substrates in a manner that the insulating members are oriented in a vertical direction, inserting at least one of the insulating members and metal electrode substrates between the stacked surfaces, and bonding the metal electrode substrates onto a top and a bottom of the second metal substrate-bonded body; and manufacturing the optical device substrate by cutting the second metal substrate-bonded body from the top to the bottom such that each cut surface has m×n number of the optical device attachment areas.