| 摘要 |
The device has housing (12) which is threaded so as to be installed on an object (10) to be grounded. A molded integrated circuit (IC) is arranged on side of one end of the housing to seal the electronic component which is mounted on a lead frame to be grounded. A cover (18) is arranged on the housing corresponding to opposite side of molded IC to seal against electrical noise. A pin (40) made of a conductive metal is fixed to the housing. The pin penetrates the lead frame and is in contact with the cover. |
