| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of inhibiting increase of the cost required for a mechanism for driving a nozzle.SOLUTION: A substrate processing apparatus 1 comprises: a spin chuck 3 which rotates a substrate W while holding the substrate W in a horizontal manner; a nozzle 5 which discharges a process liquid to a part of a peripheral part of an upper surface of the substrate W; a nozzle rotation mechanism 35 which causes the nozzle 5 to rotate around a rotation axis L2; a process liquid supply mechanism 6 which supplies the process liquid to the nozzle 5; and a rotational angle control device which causes the nozzle rotation mechanism 35 to change a rotation angle of the nozzle 5. The nozzle 5 includes a discharge port formed on a lower surface 5a of the nozzle 5. The discharge port of the nozzle 5 is disposed at a position separated from the rotation axis L2.</p> |
